3C Machines for Fast, Stable, High-Yield Electronics Production

Our 3C automation lineup is designed for smartphones, tablets, wearables, and smart accessories. From precision assembly to AOI inspection and final function testing, each machine is engineered for micron-level repeatability, rapid changeover, and 24/7 production reliability.

±0.01 mmRepeat positioning accuracy
99.2%Typical first-pass yield
< 8 minTooling changeover time
30%+Labor reduction in final assembly

Machine Portfolio

Modular platforms that scale from pilot runs to high-volume multi-line deployments.

Micro-Screw Fastening Cell — MSF-1200

Multi-axis servo fastening system for phone frames, hinge modules, and mid-frame assemblies. Built-in torque-angle monitoring detects cross-threading and missing screws in real time.

Inline screw presence check Auto bit wear compensation MES traceability

Camera Module Alignment Station — CMA-880

Active alignment platform with high-speed vision and UV curing. Ideal for smartphone camera modules requiring strict tilt, MTF, and optical axis control.

Sub-pixel vision feedback 6-DOF alignment Recipe-based switching

Display Bonding & OCA Lamination Line — DBL-2000

Bubble-free lamination for OLED/LCD assemblies with pressure profile control and automatic dust detection before bonding.

Vacuum lamination chamber Particle inspection Yield-focused SPC dashboard

Final Functional Test & Sorting — FFT-960

End-of-line functional verification covering button response, speaker/mic loopback, charging, wireless signals, and sensor calibration with auto NG segregation.

Parallel multi-port test Cloud-ready data export Barcode & serial mapping

Deployment Workflow

A practical, production-first approach to reduce ramp-up risk.

Step 1

Process Audit

Cycle-time analysis, CTQ identification, and bottleneck mapping for your current line.

Step 2

Prototype Validation

Sample runs with your product and fixtures to verify takt time, CPK, and defect modes.

Step 3

Line Integration

SMEMA/SECS-GEM connectivity, MES handshake, and operator training for stable launch.

Step 4

Continuous Optimization

Remote diagnostics, preventive maintenance plans, and KPI-driven parameter tuning.

Typical Technical Specifications

Capability Standard Range Notes
Positioning Accuracy ±0.01 mm to ±0.02 mm Depends on process head and fixture design
Cycle Time 3.5 s to 12 s per station Configurable with parallel axes and dual-lane options
Vision Inspection Resolution 5 μm/pixel to 12 μm/pixel Supports defect libraries and AI-assisted classification
Traceability Full lot-to-unit trace Barcode/QR/laser serial linked to process and test data
Connectivity MES / ERP compatible OPC UA, TCP/IP, and custom protocol bridges available

Frequently Asked Questions

Can these machines handle frequent model changes in consumer electronics?

Yes. Recipe-based setup and quick-change fixture architecture support high-mix manufacturing with minimal downtime.

Do you support cleanroom-ready configurations?

We offer cleanroom-compatible builds, including material selection, enclosure sealing, and airflow-friendly cabinet layouts.

How quickly can a new line be launched?

Typical lead time is 10–16 weeks depending on scope. Pilot validation often starts earlier to accelerate production readiness.

Planning a new smartphone or wearable line?

Get a tailored machine proposal with ROI, takt-time simulation, and layout recommendations.

Request Engineering Consultation